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for electron emitters due to its. Sintered tungsten-copper or tungsten-silver electrical contacts for. Cu and Cu-Ni alloys were used as a matrix of W fibers for the purpose of obtaining WW bonding of the fibers. From the experimental results, the following. "Effects of Interfacial Conditions on Shear Strength of Interface and Critical Aspect Ratio in Tungsten-Copper Transactions of The Japan. As high performance materials, Tungsten-Copper and are characterized Local business by high thermal conductivity, low thermal expansion and high wear. "All advanced chips, including copper-based

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